Iedm 2024 Tsmc Full

Iedm 2024 Tsmc Full. N7 entered high volume manufacturing (hvm) in 2018, at fab 15. At iedm in december, jin cai of tsmc presented device technology for 3nm node and beyond during the short course on sunday.

Tsmc provided a forecast for more than 200 n7/n7+ new tapeouts (ntos) in 2020. Clearly 2d materials are of great interest at least to two of the three leading edge logic companies.